Thermal Compounds
Zalman STC9 Thermal Paste, 4g Premium Compound for All Processors, CPU Cooler Heatsink, PS5, Xbox, Gaming Console, GPU, Superconducting Micro-Filler Density Technology, 9.1 W/m-k, Grey | ZM-STC9
- Model: ZM-STC9
- Dimensions(Syringe): 117.4(W) x 21.2(L) x 15(H) mm
- Weight: 4g
- Color: Gray
49.04 د.إ
ZM-STC9 in any application can last up to 10 years, which can fill up space between the heatsink and CPU to maximize cooling performance. Measuring graduations for convenience Easy to use and store Best cooling performance Optimum Viscosity
Technical Specifications
| Model | ZM-STC9 |
| Dimensions(Syringe) | 117.4(W) x 21.2(L) x 15(H) mm |
| Weight | 4g |
| Color | Gray |
| Thermal Conductivity | 9.1 W/m·K |
| Density | 2.7g/㎤ |
| Viscosity | 250 Pa.s |
| Materials | Silicone Oil, Alumina, Aluminum, Zinc Oxide |
There are no reviews yet.