Thermal Compounds
Aerocool COG 4g PC Thermal Paste with Nano Technology, High Performance, 8.5W, High Viscosity for Easy Application, 8.5 W/m-K Thermal Conductivity
- Model: Cog-4g
- Thermal Conductivity: >8.5 W/m-K
- Thermal Impedance: <0.0016 ℃-in2/W
- Specific Gravity: >3.25
25.55 د.إ
Cog 4g THERMAL PASTE High-performance thermal paste specially designed for overclocking or gaming PCs. Comes with 4g thermal paste that’s easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Comes with a spreader for quick and easy application. Key Features Resealable storage bag for convenient usage and storage Highly durable for long-lasting use of up to 8 years High viscosity allows for easy application Nanotechnology improves h
Technical Specifications
| Model | Cog-4g |
| Thermal Conductivity | >8.5 W/m-K |
| Thermal Impedance | <0.0016 ℃-in2/W |
| Specific Gravity | >3.25 |
| Viscosity | 1000 cps |
| Thixotropic Index | 330 ±10mm |
| Moment Beared Temperature | -50~340℃ |
| Operation Temperature | -30~280℃ |
| Silicone Compounds | 30% |
| Carbon Compounds | 20% |
| Metal Oxide Compounds | 50% |
| Net Weight | 4g |
| EAN Code | 4710562755503 |
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