MD's Zen architecture was a milestone in the history of CPU architecture and a stroke of genius by the Texas based chipmaker. Instead of resting on its laurels, AMD has been busy improving the "Zen" processors. The result is the new " Ryzen 3000 " processor family based on the "Zen2" architecture with its chiplet design . The Ryzen 9 3900X for example consists of a 12-nm I/O die and two CPU dies manufactured in a 7-nm process. This chip design however has also changed the layout of the CPU dies on the package, which has also shifted the thermal center point . On a processor with only one CPU die under the heatspreader, the "hot spot" is in the middle of the CPU. Due to the new chip design, the "hot spot" has moved to the edge of the heatspreader. This has an influence on the cooling behavior of CPU coolers. Especially AiOs (All in One watercoolers) – or CLCs (Closed Liquid Coolers) – with a round cooling block often do not completely cover the corners of the heatspreader. For an optimal cooling performance, the base plate of the AiO would have to be shifted around. This is where professional overclocker Roman Hartung comes into play. Using his der8auer RYZEN 3000 OC Bracket AIO Mount the base plate of an AIO can be flexibly positioned on the heatspreader.

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Canon C-EXV 42B Black Toner Cartridge | CEXV42
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Zebra ZT620-TT Industrial Printer, 14 ips Print Speed, Thermal Transfer Technology, Bluetooth, Ethernet, USB, 9 Pin RS-232 Interfaces, 1GB RAM + 2GB ROM, Gray / Black | ZT620-TT
CZUR Shine Ultra Smart Document Scanner, CMOS 13 MP CMOS Camera, Max DPI 340, A3/A4 Format, Al Optimization, Adjustable Height, Auto-Flatten & Deskew, USB 2.0, Windows & Mac OS, Black | SHINE-ULTRA
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Lian-Li UNI FAN TL120 LCD Wireless Case Fan, 120mm Fan Size, 1900 RPM Fan Speed, 62 CFM Fan Airflow, Fluid Dynamic Bearing Type, PBT & PA66 Material, Singe Pack, Black | 12TLLCD1W1B
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