The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating. Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs. Most excellent thermal conductivity No bleeding long-term stability high compression rate Application Rating Thermal Conductivity ***** <td style="he
Thermal Compounds
Thermal Grizzly TG-MPE Minus Pad Extreme, Most Excellent Thermal Conductivity, 100x100x0.5 Dimension, Long Term Stability, High Compression Rate | TG-MPE-100-100-05-R
- Application: Rating
- Thermal Conductivity: *****
- Sub-Zero Overclocking: *
- Overclocking: ****
130.73 د.إ
Technical Specifications
| Application | Rating |
| Thermal Conductivity | ***** |
| Sub-Zero Overclocking | * |
| Overclocking | **** |
| Water Cooling | ***** |
| Air Cooling | ***** |
| Silicone Sensitive Areas | — |

Ubiquiti Networks Cloud Gateway Ultra with 30+ UniFi Device / 300+ Client Support, 1 Gbps Routing with IDS/IPS, 0.96" LCM Status Display, Multi-WAN Load Balancing, USB-C Powered, White | UCG-Ultra
APC Smart-UPS X, Line Interactive, 1000VA Rated Power, Rack/Tower Convertible 2U, 230V Input & Output Voltage, 8x C13 IEC Connection Type, SmartSlot, Extended Runtime, Black | SMX1000I
Arctic MX-4 (45g) Thermal Paste, High Performance, 8.5 W/(MK) Conductivitiy | ACTCP00024A









There are no reviews yet.