The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating. Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs. Most excellent thermal conductivity No bleeding long-term stability high compression rate Application Rating Thermal Conductivity ***** <td style="he
Thermal Compounds
Thermal Grizzly TG-MPE Minus Pad Extreme, Most Excellent Thermal Conductivity, 100x100x0.5 Dimension, Long Term Stability, High Compression Rate | TG-MPE-100-100-05-R
- Application: Rating
- Thermal Conductivity: *****
- Sub-Zero Overclocking: *
- Overclocking: ****
130.73 د.إ
Technical Specifications
| Application | Rating |
| Thermal Conductivity | ***** |
| Sub-Zero Overclocking | * |
| Overclocking | **** |
| Water Cooling | ***** |
| Air Cooling | ***** |
| Silicone Sensitive Areas | — |

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